Product Information
Precision IC substrates engineered by PRS are to unleash the full potential of advanced semiconductors. Our solutions provide the essential foundation for high-performance computing, and 5G systems - enabling ultra-high-density interconnections, superior thermal management, and uncompromised signal integrity. Leveraging cutting-edge manufacturing and materials, we ensure your most innovative designs achieve optimal performance, reliability, and miniaturization.
Partner with PRS to build the future of technology from the substrate up.
| Layer | 6 |
|
| Final Thickness | 0.29mm | |
| Material | MGC HL832NS | |
| Product Type | SIP | |
| Strip Size | 240*74mm | |
| Surface Finish | Soft Au+Hard Au+OSP | |
| Drill | 0.065mm | |
| Copper Thickness | 15um | |
| Minimum Hole Size | 18/18um | |
| Business Segment | Consumer Electronics |
| Layer | 6 |
|
| Final Thickness | 0.23mm | |
| Material | DS-7409HGBJE(M) | |
| Product Type | LGA | |
| Strip Size | 93.81*93.81mm | |
| Surface Finish | ENIG | |
| Drill | 0.055mm | |
| Copper Thickness | 12um | |
| Minimum Hole Size | 30/40um | |
| Business Segment | Consumer Electronics |

